25 January 2019
Visiongain has launched a new packaging report Wafer Level Packaging Market Report 2019-2029: Forecasts by Packaging Technology (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP and Others), by Integration Type (Fan-in WLP and Fan-out WLP) and by Industry (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defence, Healthcare and Others) Plus Profiles of Leading Companies and Regional and Leading National Market Analysis.
The Visiongain report analyst commented "Wafer Level Packaging market is expected to witness a high growth on account of ongoing increased current and emerging applications, increased technological advancement. In addition, the rapidly expanding trend of thin and lightweight mobile devices and Increased penetration of electronic design automation in the automotive industry are main driving forces for the wafer level packaging market during the forecast period. The Wafer Level Packaging market is also driven by key strategies adopted by the key players in this industry such as product enhancement; acquisitions & mergers; agreements & collaborations; and expansion. Product enhancement was the most commonly adopted strategy by the leading players in Wafer Level Packaging market."
Leading companies featured in the report who are manufacturing Wafer Level Packaging include Amkor Technology, Inc, Applied Materials, Inc, ASML Holding N.V., Deca Technologies Inc., Fujitsu Limited, Jiangsu Changjiang Electronics Technology Co., Ltd., KLA-Tencor Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Rudolph Technologies, Inc., Siliconware Precision Industries Co., Ltd., Toshiba Electronic Devices & Storage Corporation, Tokyo Electron Limited and Ultratech, Inc
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